HP Thin Technologies: A Competitive Comparison

As the drive to “do more with less” becomes a mantra for many organizations, optimizing space utilization is a key goal of many IT departments.  Storage continues to be one of the major cost components of today’s infrastructure deployments.  Thin technology, including thin provisioning, offers efficiency benefits that can significantly reduce both capital and operational costs.  However, implementations of thin technologies differ with the storage vendors.  This Edison Group report looks at thin provisioning technology from the major storage vendors in today’s marketplace and compares the thin implementations from seven storage array platforms, including Hewlett-Packard’s 3PAR  StoreServ Storage arrays. Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.